Major technological choice trends in these segments can therefore rapidly impact the power module packaging overall market. For instance, the penetration of silver sintering as a die-attach technology is increasing among the industry, and even arriving in some EV/HEV power modules.
STATUS OF THE POWER MODULE PACKAGING INDUSTRY 2019 substrate for low- and mid-power devices. In order to make the power module package more stable thermally, and to take advantage of SiC’s properties, reliable and robust die attach is required. Therefore, the use of silver sintering is increasing.
Power module packaging solutions are moving towards high-performance materials and reduction of the number of layers, size, and interfaces, while conserving electrical, thermal, and mechanical characteristics. In terms of substrate, the most common choice for power module packaging is Al 2O DBC (direct-bonded copper). As shown
The EV/HEV industry’s demanding requirements for high power density and mechatronics integration are driving many of the other power packaging innovations. Today, there are two clear trends: over-molded double-side cooled modules for hybrid cars and single-side cooled modules with pin-fin baseplates for battery-only electric cars.
Although no major packaging technology breakthrough has been observed over the last several months, many technology trends from the past have been confirmed. EV/HEV applications are increasingly driving the technology trends in power module packaging, where high power density and highly reliable power module packages are needed.
The power module packaging material market will achieve a 2018 - 2024 CAGR of 7.8%, reaching the $2.17B business opportunity by 2024 and representing more than one-third of the power module market. In terms of technology and market forecast, this
An inverter packaging scheme for an integrated segmented traction drive ...
Abstract: The standard voltage source inverter (VSI), widely used in electric vehicle/hybrid electric vehicle (EV/HEV) traction drives, requires a bulky dc bus capacitor to absorb the large switching ripple currents and prevent them from shortening the battery''s life. The dc bus capacitor presents a significant barrier to meeting inverter cost ...
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In 2019, Yole Développement has released this update of a Power Module Packaging: Material Market and Technology Trends 2018 report. Discuss the impact of application trends on package design and packaging materials. Identify the key technology trends that will shape the power packaging market in the future. One single device in the package. scope?
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To provide market analysis and forecasts for power module packaging. To provide a deep insight into state-of-the-art package designs and materials. To identify the key technology trends that …
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Status of Power Module Packaging
In 2019, Yole Développement has released this update of a Power Module Packaging: Material Market and Technology Trends 2018 report. Discuss the impact of application trends on …
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Develop packaging technologies and highly integrated SiC power modules for automotive inverters/converters with lower thermal resistance, small electrical parasitic parameters, and …
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The standard voltage source inverter (VSI), widely used in electric vehicle/hybrid electric vehicle (EV/HEV) traction drives, requires a bulky dc bus capacitor to absorb the large switching ripple currents and prevent them from shortening the battery''s life. The dc bus capacitor presents a significant barrier to meeting inverter cost, volume, and weight requirements for mass …
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To achieve the best performance out of WBG device advances, attention must be paid to electronic packaging. Reduction of parasitics, higher frequency operation, thermal …
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As inverter designs evolved, engineers packaged the subassemblies in smarter, more efficient ways, such as stacking the control board right on top of the power module. On-going advances …
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An inverter packaging scheme for an integrated segmented …
Abstract: The standard voltage source inverter (VSI), widely used in electric vehicle/hybrid electric vehicle (EV/HEV) traction drives, requires a bulky dc bus capacitor to absorb the large …
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Rapid progress in packaging technologies enables cheaper, smaller and more reliable EV/HEV inverter. ... Limiting factor for inverter cooling system? Low inductance (likely …
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To provide market analysis and forecasts for power module packaging. To provide a deep insight into state-of-the-art package designs and materials. To identify the key technology trends that will shape the power packaging market in the future. To understand the main challenges and proposed innovations for power packaging.
Learn More
Future Packaging Technologies in Power Electronic Modules
Thus it appears that SiC semiconductor devices are now used in power electronics mainly for switching high electrical currents (up to several 100 A) and high voltages (≥ 1 kV) in …
Learn More
