Berkeley Lab scientists have achieved record-high energy and power densities in microcapacitors made with engineered thin films, using materials and fabrication techniques already widespread in chip manufacturing. Their work paves the way for advanced on-chip energy storage and power delivery in next-generation electronics.
The properties of the resulting devices are record breaking: compared to the best electrostatic capacitors today, these microcapacitors have nine-times higher energy density and 170-times higher power density (80 mJ-cm-2 and 300 kW-cm-2, respectively). “The energy and power density we got are much higher than we expected,” said Salahuddin.
If the capacitors can be scaled up, they could find applications in larger devices like robots and cellphones. Cheema is currently working to connect these individual microcapacitors to make larger energy-storage devices, using the facilities at MIT’s Lincoln Lab.
Cheema was part of a team that developed the new microcapacitor devices during his postdoc with Sayeef Salahuddin, a professor of electrical engineering and computer sciences at the University of California, Berkeley.
That technique is compatible with semiconductor manufacturing but would be hard to scale up to make larger capacitors for things like electric vehicles. The microcapacitors can store 80 millijoules per square centimeter—only an order of magnitude less than a lithium-ion battery, says Cheema.
Published by American Chemical Society. This publication is licensed under CC-BY 4.0. Microsupercapacitors (MSCs) have emerged as the next generation of electrochemical energy storage sources for powering miniaturized embedded electronic and Internet of Things devices.
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