But also for industrial productions, batteries are soldered as for example the battery modules of the full electric MINI E by the BMW AG . In principal, soldering and brazing are based on a joining process where the joining partners are connected by melting and putting a filler metal, the solder, into the joint , .
Solder joints in electronics act as electrical connection, thermal dissipation channel and mechanical support. The failure of one solder joint usually results in the loss of one function or the breakdown of the whole electronics. Therefore, the reliability of solder joints is quite essential for the well function of electronics.
Solder joints act as thermal, electrical and mechanical connection between the encapsulated chip and the printed circuit board (PCB) in electronic assemblies , , .
For later times, a linear increase in the electrical resistance of the solder joints with respect to time was observed. The change in electrical resistance was found to be linearly proportional to the thickness of a continuous Bi layer accumulating at the anode during current stressing.
Electrical resistance increases gradually in the crack propagation phase and there is a sudden change of resistance in the catastrophic failure. C-SAM images showed strong correlation between the initiation and growth of cracks in solder joints and the change of electrical resistance of solder joints.
The quantitative calculation of the contribution ratio of each field (electric current stressing, thermal heating and mechanical loading) on the mechanical performance of solders or solder joints under electric current stressing should be achieved. One of the key problems is the precise detection of the temperature of the microscale samples.
Recent advances in Sn-based lead-free solder interconnects for ...
According to the comparative study on the effect of ultrasonic-aided soldering duration on the shear strength of Cu/Ni–Sn/Cu joints, the following findings were observed: (i) shear strength of 24 MPa was measured at 5 s with fracture occurring within the solder, (ii) shear strength of 58 MPa was measured at 20 s with fracture ...
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Changes in the Microstructure and Electrical Resistance of
The change in the electrical resistance of a SnBi-based solder joint during current stressing has been measured. For early times, a distinct, non-linear signal was observed and correlated with the initial formation of a continuous Bi layer via a lateral growth mechanism. For later times, a linear increase in the electrical resistance of the solder joints with respect to …
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Advances on high current load effects on lead-free solder joints of …
This paper aims to present a novel approach on investigating critical current densities in the solder joints of chip-size surface-mounted components or device (SMD) components and ball …
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Electromigration effect on Sn-58 % Bi solder joints with various ...
The electromigration behavior of low-melting temperature Sn-58Bi (in wt%) solder joints was investigated with a high current density between 3 and 4.5 × 103 A/cm2 between 80 and 110 °C. In order to analyze the impact of various substrate metallizations on the electromigration performance of the Sn-58Bi joint, we used representative substrate …
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Current-induced solder evolution and mechanical property of Sn …
In this study, the current-induced microstructure characteristics and mechanical behavior of Sn-3.0Ag-0.5Cu (SAC305) solder joints during thermal shock process was thoroughly addressed over cycles by combining diffusional, electrical, thermal and mechanical features.
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Study on Phase Electromigration and Segregation Behavior of
In this work, the effect of the Cu-cored structure on phase migration and segregation behavior of Sn-58Bi solder interconnects under electric current stressing is quantitatively studied using a developed phase field model.
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Electrical resistances of soldered battery cell connections
This work evaluates soldered connections for battery cells by assessing the electrical connection resistance with a special measuring and calculation method. Due to the …
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BASIC PARAMETERS CONTROLLING CURRENT STRESSING …
The electrical resistances of Cu/Sn57BiSbNi/Ni solder joints were continuously monitored during current stressing at temperatures between 95 and 125°C, and current densities up to 7kA/cm2,...
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CHAPTER III Solder Joint Reliability Assessment
In this chapter, we evaluate the reliability of the produced solder joints for power chip interconnection. First, the current solder joint fatigue study approaches are introduced and the popular solder joint fatigue models of solder joint reliability assessment and life prediction are briefly reviewed.
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Effect of electric current stressing on mechanical performance of ...
Mechanical performance is one of the most important factors influencing the reliability of solder joints. Heretofore, plenty of works have been conducted on reliability of solder joints under various mechanical loads. However, with the miniaturization of electronic products, the current density flowing through the solder joints is increasing. Electric current stressing can …
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Electromigration in solder joints: A cross-sectioned model …
This uneven current distribution across the solder joint has given rise to another driving factor, thermomigration [13]. EM also influences the formation of intermetallic compounds (IMCs); the formation of IMCs has been shown to accelerate failures in solder joints [18]. Thus, the unique features in solder joints such as the line-to-bump geometry, solder composition as …
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Changes in the Microstructure and Electrical Resistance of
The change in the electrical resistance of a SnBi-based solder joint during current stressing has been measured. For early times, a distinct, non-linear signal was …
Learn More
Effect of electric current stressing on mechanical performance of ...
However, with the miniaturization of electronic products, the current density flowing through the solder joints is increasing. Electric current stressing can induce microstructure evolution, and mechanical performance of solder joints may be altered consequently, which leads to electric current stressing becoming an important factor ...
Learn More
Current-induced solder evolution and mechanical property of Sn …
In this study, the current-induced microstructure characteristics and mechanical behavior of Sn-3.0Ag-0.5Cu (SAC305) solder joints during thermal shock process was …
Learn More
BASIC PARAMETERS CONTROLLING CURRENT STRESSING …
The electrical resistances of Cu/Sn57BiSbNi/Ni solder joints were continuously monitored during current stressing at temperatures between 95 and 125°C, and current …
Learn More
Effect of electric current stressing on mechanical performance of ...
However, with the miniaturization of electronic products, the current density flowing through the solder joints is increasing. Electric current stressing can induce …
Learn More
Advances on high current load effects on lead-free solder joints …
This paper aims to present a novel approach on investigating critical current densities in the solder joints of chip-size surface-mounted components or device (SMD) components and ball grid array (BGA) lead-free solder joints with the focus of via-in-pad geometries.
Learn More
CHAPTER III Solder Joint Reliability Assessment
In this chapter, we evaluate the reliability of the produced solder joints for power chip interconnection. First, the current solder joint fatigue study approaches are introduced and the …
Learn More
Changes in the Microstructure and Electrical Resistance of
The change in the electrical resistance of a SnBi-based solder joint during current stressing has been measured. For early times, a distinct, non-linear signal was observed and correlated with the initial formation of a continuous Bi layer via a lateral growth mechanism. For later times, a linear increase in the electrical resistance ...
Learn More
Recent advances in Sn-based lead-free solder interconnects for ...
According to the comparative study on the effect of ultrasonic-aided soldering duration on the shear strength of Cu/Ni–Sn/Cu joints, the following findings were observed: (i) …
Learn More
Understanding Cold Solder Joints
Soldering is a fundamental skill in electronics, and the quality of a solder joint can significantly impact the performance and longevity of an electronic device. It is a method used to join two metal items by melting and flowing a filler metal into the joint.One common issue faced by many is the cold solder joint. In this article, we will understand cold solder joints and how to …
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pcb
My concerns are mostly on the solder joints. The drivers have pins and I need to solder it onto the PCB. The gap between the pins and the copper on the PCB needs to be filled with solder. Also I have some small disconnected paths on the PCB. They are small enough to be filled with solder but as I want to be safe I want to connect this paths ...
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Electrical resistances of soldered battery cell connections
This work evaluates soldered connections for battery cells by assessing the electrical connection resistance with a special measuring and calculation method. Due to the solder layer in...
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Electromigration with Alternating Current in Solder Joints in …
In this study, direct current (DC) and alternating current (AC) electromigration experiments were carried out using solder joints with a Cu/eutectic Pb-Sn/Cu joint configuration. During stressing ...
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Impact of in situ current stressing on Sn-based solder joint shear ...
This paper reports experimental observations showing that a current flow produces an effect of strengthening a solder joint against a shear load. This conclusion is found from a single-joint shear test conducted on Sn–1Ag–0.5Cu wt% (SAC 105) joints with in situ current stressing varied from 700 to 1400 A/cm2 at room temperature. To isolate the current …
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fixing a leaking soldered joint without separating the joint
fixing a leaking soldered joint without separating the joint. Thread starter dragonfly101; Start date 13 Jan 2014; D. dragonfly101. Joined 27 Dec 2013 Messages 109 Reaction score 4 Location Hampshire Country. 13 Jan 2014 #1 I''ve been fitting some pipe this weekend using pre-soldered joints, and out of the 20 I fitted I have one that is leaking (a …
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Electrical resistances of soldered battery cell connections
This work evaluates soldered connections for battery cells by assessing the electrical connection resistance with a special measuring and calculation method. Due to the solder layer in between the joint partners, the current paths differ from welded connections. A resistance network and a finite element model (FEM) simulation are applied to ...
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Electromigration Behavior of Cu Core Solder Joints Under High Current …
Abstract Cu core solder ball (CCSB) is formed by a Cu core surrounded by solder alloy and is used as an interconnection material for 3D packaging. Herein, the electromigration behavior of CCSBs with an organic solderability preservative surface finish is compared with that of Sn–3.0Ag–0.5Cu (SAC) solder joint. The current density and …
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Study on Phase Electromigration and Segregation Behavior of
In this work, the effect of the Cu-cored structure on phase migration and segregation behavior of Sn-58Bi solder interconnects under electric current stressing is …
Learn More
